Detailed Specification

CPU

2 x 3^rd generation Intel® Xeon® Ice Lake SP series

(each processor up to 40 cores and maximum 270W power consumption)

Chipset

Intel® C621A

Memory

32 x DDR4 DIMM slots , maximum 6.0 TB

Up to 3200 MT/s data transfer rate RDIMM

Up to 16 Intel ® Optane™ DC Persistent Memory Module PMem 200 series ( Barlow Pass)

Storage controller

Embedded RAID controller

Standard PCIe HBA cards and storage controllers，depending on model

FBWC

8 GB DDR4 cache, depending on model ,support supercapacitor protection

Storage

Up to Front 4LFF bays, Rear 2SFF bays*

Up to Front 10SFF bays, Rear 2SFF bays*

Front SAS/SATA HDD/SSD/NMVe Drives, maximum 8 x U.2 NVMe Drives

SATA/PCIe M.2 SSDs，2 x SD card kit , depending on model

Network

1 x onboard 1 Gbps management network port

1 x OCP 3.0 slot for 4 x 1GE or 2 x 10GE or 2 x 25GE NIC

PCIe Standard slots for 1/10/25/40/100GE/IB Ethernet adapter，

PCIe slots

4 x PCIe 4.0 standard slots

Ports

VGA connectors (Front and Rear) and serial port (RJ-45)

5 x USB 3.0 ports (1 front, 2 rear, and 2 internal)

1 dedicated management Type-C port

GPU

4 x single-slot wide GPU modules

Optical drive

External optical disk drive，optional

Management

HDM OOB system (with dedicated management port) and H3C iFIST/FIST, support LCD touchable smart model

Security

Intelligent Front Security Bezel *

Chassis Intrusion Detection

TPM2.0

Silicon Root of Trust

2FA for HDM

Power supply

2 x Platinum 550W/800W/850W/1300W/1600W (1+1 redundancy) ,depending on model

800W –48V DC power supply (1+1 Redundancy)

Hot swappable redundant fans

Standards

CE，UL , FCC，VCCI，EAC, etc.

Operating temperature

5°C to 45°C (41°F to 113°F)

The maximum operating temperature varies by server configuration. For more information, see the technical documentation for the device.

Dimensions (H × W × D)

1U Height

Without a security bezel: 42.9 x 434.6 x 780 mm (1.69 x 17.11 x 30.71 in)

With a security bezel: 42.9 x 434.6 x 808 mm (1.69 x 17.11 x 31.81 in)